Based on real 800G-LR4 pluggable modules, we have conducted the first test validation on the transmitter power, extinction ratio, OMA, TECQ and TDECQ with DGD. kuschnerov_3dj_optx_01_230829, and support the 800G-LR4 baseline described in rodes_3dj_01_2309. According to the 2024 Report on U. S Data Center Energy Use, published by the Lawrence Berkeley National Laboratory, data centers account for 4. 4% of total electricity consumption in the U. in 2023, and are projecte to increase to 6. The. Xiang Liu(1), Qirui Fan(1), Frank Chang(2), Roberto Rodes(3), Maxim Kuschnerov(4), John Johnson(5), Rang-Chen (Ryan) Yu(6), Ernest Muhigana(7), Nobuhiko Kikuchi(8), and Chris Cole(3) (1)Huawei Hong Kong Research Center, China; (2)Source Photonics, USA; (3)Coherent, USA; (4)Huawei European Research. The OSFP MSA is proud to introduce OSFP1600 and OSFP-XD to the industry. The OSFP-XD solution has attracted significant interest in. TE Connectivity (TE) is demonstrating its octal small form-factor pluggable (OSFP) input/output (I/O) connector in the form of two MCB connector module cable test boards, demonstrated in a CEI-224G channel. In addition, TE has provided the cabled host version of 224G OSFP known as the AdrenaLINE. This CEI-224G-Linear demonstration shows test chip silicon sending a PRBS13Q PAM4 212 Gbps signal through a 1. 6T DR8 OSFP linear optical module via Module Compliance Board. Forward error correction (FEC) is required to be implemented by the host in order to ensure reliable system operation.